SR-28G Engine

  • 产品详情
  •          1        PRODUCT DESCRIPTION

    The QSFP+ to SFP+ hybrid cable assembly solution is specially designed for high-speed applications to interconnect QSFP+ port to SFP+ port(s). QSFP+ to SFP+ hybrid cable assembly family consists of QSFP+ to 1SFP+, QSFP+ to 2SFP+ and QSFP+ to 4SFP+.

     

    This QSFP+ to SFP+ hybrid cable assemblies is high performance; high bandwidth and cost effective interconnect solutions which support Ethernet and InfiniBand standards with different data rate applications.

     

    The limits and specifications provided in this datasheet are informative only as there is no industrial specification governing QSFP+ to SFP+ hybrid cable assembly. The limits and specifications provided in this datasheet are subject to change.

     

    2        REFERENCE INDUSTRY DOCUMENTS

    The following documents, of the latest issues in effect at the time of performance of the qualification tests, are the reference documents for this datasheet.

                

    Document Number

    Title

    SFP Multi-Source   Agreement

    Physical Specifications   of SFP

    SFF-8436

    Specification for QSFP+ 10 Gbs 4X Pluggable Transceiver

    SFF-8431

    Specification for   Enhanced Small Form Factor Pluggable Module SFP+

    EIA-364

    EIA Standard

    UL 94

    Tests for Flammability of   Plastic Materials for Parts in Devices and Appliances.  Underwriters Laboratories, Inc.

    EIA-364-1000.01

    Environmental Test   Methodology for Assessing the Performance of Electrical Connectors and   Sockets Used in Business Office Applications

     

    3        SPECIFICATIONS

    3.1       Material

    3.1.1      Backshell

    Zinc alloy. Nickel plated over all 100u” Min.

    3.1.2      PCB Contact Configuration

    QSFP+ paddle card:


    SFP+ paddle card:


    3.1.3      PCB Contact Plating

    100 u" min. nickel underplate over all

    30 u” min. gold over nickel at contact area

    3.1.4      Raw Cable

    High Speed cable, 2 pairs, 100 +/- 5 ohms

     

    3.2       Ratings

    Item

    Specification

    Voltage

    30VAC (rms) or DC

    Current

    0.5A/Contact

    Operating   Temperature

    -40  to  85

     

     

    3.3       Electrical

    Item

    Specification

    Low   Level Contact Resistance

    Initial: Baseline

    Change : 20 milliohms maximum

    Insulation   Resistance

    300VDC , 1000Mohm(Min.)

    Dielectric   Withstanding Voltage

    AC   350V 1min,

    no breakdown or flash

     

    3.4       Signal Integrity

    Item

    Specification

    Insertion Loss

    Frequency       SDD21(min)
      100 MHz                  -8
      200 MHz                  -8
      625 MHz                  -8
      1250 MHz                -9
      1875 MHz                -10.4
      2500 MHz                -12.1
      3750 MHz                -14.7
      5000 MHz                -17

    Return Loss


      <-10;                          0.1
    f<1 ;   

    <-12+2*SQRT(f);         1f<4.11   ; 

    <-6.3+13log10(f/5.5);    4.11f10 ;

    where f in GHz.

     





             1        PRODUCT DESCRIPTION

    The QSFP+ to SFP+ hybrid cable assembly solution is specially designed for high-speed applications to interconnect QSFP+ port to SFP+ port(s). QSFP+ to SFP+ hybrid cable assembly family consists of QSFP+ to 1SFP+, QSFP+ to 2SFP+ and QSFP+ to 4SFP+.

     

    This QSFP+ to SFP+ hybrid cable assemblies is high performance; high bandwidth and cost effective interconnect solutions which support Ethernet and InfiniBand standards with different data rate applications.

     

    The limits and specifications provided in this datasheet are informative only as there is no industrial specification governing QSFP+ to SFP+ hybrid cable assembly. The limits and specifications provided in this datasheet are subject to change.

     

    2        REFERENCE INDUSTRY DOCUMENTS

    The following documents, of the latest issues in effect at the time of performance of the qualification tests, are the reference documents for this datasheet.

                

    Document Number

    Title

    SFP Multi-Source   Agreement

    Physical Specifications   of SFP

    SFF-8436

    Specification for QSFP+ 10 Gbs 4X Pluggable Transceiver

    SFF-8431

    Specification for   Enhanced Small Form Factor Pluggable Module SFP+

    EIA-364

    EIA Standard

    UL 94

    Tests for Flammability of   Plastic Materials for Parts in Devices and Appliances.  Underwriters Laboratories, Inc.

    EIA-364-1000.01

    Environmental Test   Methodology for Assessing the Performance of Electrical Connectors and   Sockets Used in Business Office Applications

     

    3        SPECIFICATIONS

    3.1       Material

    3.1.1      Backshell

    Zinc alloy. Nickel plated over all 100u” Min.

    3.1.2      PCB Contact Configuration

    QSFP+ paddle card:


    SFP+ paddle card:


    3.1.3      PCB Contact Plating

    100 u" min. nickel underplate over all

    30 u” min. gold over nickel at contact area

    3.1.4      Raw Cable

    High Speed cable, 2 pairs, 100 +/- 5 ohms

     

    3.2       Ratings

    Item

    Specification

    Voltage

    30VAC (rms) or DC

    Current

    0.5A/Contact

    Operating   Temperature

    -40  to  85

     

     

    3.3       Electrical

    Item

    Specification

    Low   Level Contact Resistance

    Initial: Baseline

    Change : 20 milliohms maximum

    Insulation   Resistance

    300VDC , 1000Mohm(Min.)

    Dielectric   Withstanding Voltage

    AC   350V 1min,

    no breakdown or flash

     

    3.4       Signal Integrity

    Item

    Specification

    Insertion Loss

    Frequency       SDD21(min)
      100 MHz                  -8
      200 MHz                  -8
      625 MHz                  -8
      1250 MHz                -9
      1875 MHz                -10.4
      2500 MHz                -12.1
      3750 MHz                -14.7
      5000 MHz                -17

    Return Loss


      <-10;                          0.1
    f<1 ;   

    <-12+2*SQRT(f);         1f<4.11   ; 

    <-6.3+13log10(f/5.5);    4.11f10 ;

    where f in GHz.